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Coatings Ingredients
The material selection platform
Coatings Ingredients
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Omicure™

Coatings ingredients supplied by Huntsman

13 products match your search
Product Name
Supplier
Description
Non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. Offers good oxidation aging and improved high temperature performance. Possesses low toxicity/less irritating and low cure temperature... view more
Micronized dicyandiamide. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F... view more
Unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Primarily designed for use in solvent-based compositions. Compatible with all epoxy resins, including Bisphenol A and F... view more
An ultra-micronized grade of Dicyandiamide. Contains approximately 2-3% silica as an anti-caking aid. Provides good dispersion, prevents settling and maximizes reactivity. Compatible with all epoxy... view more
Semi-Micronized dicyandiamide. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F... view more
Monuron N-(4-Chlorophenyl) - N, N-Dimethyl Urea, an aromatic substituted urea. Shows a long latency in formulated systems containing Dicy and epoxy. Suggested use levels < 5 phr. Used as a latent... view more
2,4’ Toluene Bis Dimethyl Urea, a Micronized aromatic substituted urea. Reduces time and temperature of curing. Provides great degree of acceleration to epoxy/dicy formulations. Used as a latent... view more
Aliphatic Bis Urea, a Micronized cycloaliphatic substituted urea. Reduces time and temperature of curing. Provides long room temperature shelf life to epoxy/dicy formulations. Used as a latent... view more
Phenyl Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Most similar in structure to Monuron and Diuron. Does not contain any chlorine. Used as a latent... view more
Toluene Bis Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Provides great degree of acceleration to epoxy/dicy formulations. Used as a latent... view more
Micronized aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured properties in epoxy/dicy formulations. Used as a... view more
Aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured properties to epoxy/dicy formulations. Used as a latent... view more
4,4’ Methylene bis (Phenyl Dimethyl Urea), a micronized aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured... view more
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