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Coatings Ingredients
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Coatings Ingredients
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Omicure™ DDA 5

Technical Datasheet | Supplied by Huntsman
An ultra-micronized grade of Dicyandiamide. Contains approximately 2-3% silica as an anti-caking aid. Provides good dispersion, prevents settling and maximizes reactivity. Compatible with all epoxy resins including Bisphenol A and F epoxies, epoxy novolacs and a wide variety of fillers and pigments. Used as a curing agent for epoxy resins in powder epoxy coatings, electronic potting and encapsulating compounds.
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Product Type
Crosslinking / Coupling / Curing Agents > Amides
Chemical Composition
Dicyandiamide
CAS Number
461-58-5
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