Omicure™ DDA 100

Unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Primarily designed for use in solvent-based compositions. Compatible with all epoxy resins, including Bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and compatible with a wide variety of fillers and pigments. Used as a curing agent for epoxy resins in powder epoxy coatings, electronic potting and encapsulating compounds.