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Coatings Ingredients
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Coatings Ingredients
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Omicure™ DDA 100

Technical Datasheet | Supplied by Huntsman
Unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Primarily designed for use in solvent-based compositions. Compatible with all epoxy resins, including Bisphenol A and F epoxies and epoxy novolacs, can be used with diluted or undiluted resins, and compatible with a wide variety of fillers and pigments. Used as a curing agent for epoxy resins in powder epoxy coatings, electronic potting and encapsulating compounds.
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Product Type
Crosslinking / Coupling / Curing Agents > Amides
Chemical Composition
Dicyandiamide
CAS Number
461-58-5
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