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Omicure™ DDA 50

Technical Datasheet | Supplied by Huntsman
Semi-Micronized dicyandiamide. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F epoxies and epoxy novolacs), with diluted or undiluted resins and with a wide variety of fillers and pigments. Used as a curing agent for epoxy resins in powder epoxy coatings.
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Product Type
Crosslinking / Coupling / Curing Agents > Amides
Chemical Composition
Micronized dicyandiamide
CAS Number
461-58-5
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Last edited September 27, 2023
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