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Coatings Ingredients
The material selection platform
Coatings Ingredients
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23 products match your search
Product Name
Supplier
Description
Non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. Offers good oxidation aging and improved high temperature performance. Possesses low toxicity/less irritating and low cure temperature... view more
High temperature aromatic amine. Possesses low ionic level. Provides high compressive strength, low brittleness and high heat deflection temperatures. Offers good reactivity in polyimide production... view more
Fine high temperature aromatic amine. Provides high compressive strength, low brittleness and high heat deflection temperatures. Offers good reactivity in polyimide production with high temperature... view more
Ground high temperature aromatic amine. Provides high compressive strength, low brittleness and high heat deflection temperatures. Offers good reactivity in polyimide production with high... view more
Huntsman
Granular, unmicronized dicyandiamide. Used as a curing agent for epoxy resins in powder epoxy coatings. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding... view more
Micronized dicyandiamide. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F... view more
Unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Primarily designed for use in solvent-based compositions. Compatible with all epoxy resins, including Bisphenol A and F... view more
An ultra-micronized grade of Dicyandiamide. Contains approximately 2-3% silica as an anti-caking aid. Provides good dispersion, prevents settling and maximizes reactivity. Compatible with all epoxy... view more
Semi-Micronized dicyandiamide. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F... view more
Monuron N-(4-Chlorophenyl) - N, N-Dimethyl Urea, an aromatic substituted urea. Shows a long latency in formulated systems containing Dicy and epoxy. Suggested use levels < 5 phr. Used as a latent... view more
Monuron N-(4-Chlorophenyl) - N, N-Dimethyl Urea, an aromatic substituted urea. Micronized grade of OMICURE U-210. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in powder... view more
2,4’ Toluene Bis Dimethyl Urea. Aromatic substituted urea. Reduces time and temperature of curing. Provides great degree of acceleration to epoxy/dicy formulations. Used as a latent accelerator in... view more
2,4’ Toluene Bis Dimethyl Urea, a Micronized aromatic substituted urea. Reduces time and temperature of curing. Provides great degree of acceleration to epoxy/dicy formulations. Used as a latent... view more
Cycloaliphatic substituted urea. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings. Reduces time and temperature of curing. Provides long room temperature... view more
Aliphatic Bis Urea, a Micronized cycloaliphatic substituted urea. Reduces time and temperature of curing. Provides long room temperature shelf life to epoxy/dicy formulations. Used as a latent... view more
Phenyl Dimethyl Urea, an aromatic substituted urea. Reduces time and temperature of curing. Does not contain any chlorine. Most similar in structure to Monuron and Diuron. Used as a latent... view more
Phenyl Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Most similar in structure to Monuron and Diuron. Does not contain any chlorine. Used as a latent... view more
Toluene Bis Dimethyl Urea, an aromatic substituted urea. Reduces time and temperature of curing. Provides great degree of acceleration to epoxy/dicy formulations. Used as a latent accelerator in the... view more
Toluene Bis Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Provides great degree of acceleration to epoxy/dicy formulations. Used as a latent... view more
Aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured properties in epoxy/dicy formulations. Used as a latent... view more
Micronized aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured properties in epoxy/dicy formulations. Used as a... view more
Aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured properties to epoxy/dicy formulations. Used as a latent... view more
4,4’ Methylene bis (Phenyl Dimethyl Urea), a micronized aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured... view more
Hitachi Chemical
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