AMICURE® CG-1200G by Evonik acts as a latent curing agent for epoxy resins. Fine particle size provides enhanced reactivity versus coarser grades. Shows very good dispersibility in liquid epoxy... view more

AMICURE® CG-325G by Evonik is a micronized grade of dicyandiamide. Acts as a latent curing agent for epoxy resins. Its fine particle size provides enhanced reactivity versus coarser grades. It shows... view more

DICYANEX® 1200 by Evonik is an epoxy curing agents and modifiers. It is a micronized grade of dicyandiamide containing 3% of an inert flow control additive to inhibit clumping and improve handling... view more

DICYANEX® 1400B acts as a latent curing agent for epoxy resins. Shows very good dispersibility in liquid resins. Provides easy variation of activation temperature from 356°F-203°F with appropriate... view more

Dimethylolpropionic acid. It acts as a dispersing agent. It is odorless, and appears as a free flowing white crystal with molecular weight of 134.13. It can be used in water soluble PU system, water... view more

Adhesion enhancing agent SA5503 by Lu'An Jietonda New Material is an adhesion enhancing agent for powder coatings. It can improve the wettability and transfer efficiency of powder coating to... view more

Adhesion enhancing agent. Can improve the wettability and transfer-efficiency of coating to substrate effectively, especially used on stainless steel substrates and galvanized substrates. Improves... view more

Epoxy hardener SA31 by Lu'An Jietonda New Material is 2-phenyl imidazoline. Acts as an epoxy resin hardener or an accelerator. Epoxy hardener SA31 can reduce curing temperature or shorten curing time of epoxy powder coatings by... view more