The material selection platform
Coatings Ingredients
The material selection platform
Coatings Ingredients
by SpecialChem
Cette page a bien été ajoutée à vos favoris


Technical Datasheet | Supplied by Evonik
Micronized grade of dicyandiamide. Acts as a latent curing agent for epoxy resins. Fine particle size provides enhanced reactivity versus coarser grades. Shows very good dispersibility in liquid epoxy resin due to higher levels of flow additive. Offers shelf stability up to 6 months at 77°F in properly formulated systems. Provides easy variation of activation temperature from 355°F to 203°F with appropriate accelerator selection. Used for powder coatings, recreational and industrial pre-preg composites.
Product Type
Crosslinking / Coupling / Curing Agents > Amides
Chemical Composition
Micronized grade of dicyandiamide
Physical Form
Help us improve the Universal Selector

You can’t find what you are looking for? Please report missing products / suppliers, point out errors, or simply tell us how we could make the Universal Selector better.

Access Reliable
Product Information

Database of 77057 Coatings Ingredients,
reviewed and updated daily

Improve your Product
Selection Experience

Open your choices, compare products,
ask for samples, contact suppliers

Keep-up with latest
Technical Solutions

Be inspired and never miss again crucial
innovations with our weekly email updates

Back to Top