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The material selection platform
Coatings Ingredients
The material selection platform
Coatings Ingredients
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AMICURE® CG-325G

Technical Datasheet | Supplied by Evonik
Micronized grade of dicyandiamide. Acts as a latent curing agent for epoxy resins. Fine particle size provides enhanced reactivity versus coarser grades. Shows very good dispersibility in liquid epoxy resin due to higher levels of flow additive. Offers shelf stability up to 6 months at 77°F in properly formulated systems. Provides easy variation of activation temperature from 355°F to 203°F with appropriate accelerator selection. Used for powder coatings, recreational and industrial pre-preg composites.
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Product Type
Crosslinking / Coupling / Curing Agents > Amides
Chemical Composition
Micronized grade of dicyandiamide
Physical Form
Crystals
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