CUREZOL® 2MZ Azine by Evonik is an imidazole curing agent for epoxy resins. It acts as an accelerator for dicyandiamide. It is compatible with epoxy resins. It provides long latency and high heat... view more

Surfynol® 61 by Evonik is a volatile substrate wetting agent. It provides good substrate wetting properties on PE and PP. It evaporates from surfaces without leaving residues. It offers defoaming... view more

TEGO® AddBond HS by Evonik is a water-insoluble, styrene-free polyester resin. It is a colorless liquid with ester-like odor. Exhibits excellent adhesion on metal (aluminum, steel and galvanized steel)... view more

TEGO® Addbond LTW-B by Evonik is a solution of a modified special polyester in n-butyl acetate. Used as a co-binder, adhesion resin solution for solvent-borne formulations in industrial coatings, silk... view more

TEGO® Airex 900 by Evonik is a strong deaerator concentrate that combats both micro- and macro-foam. It is designed for high build and high-viscosity applications. It exhibits a fast and efficient... view more

TEGO® Airex 920 by Evonik is a defoamer and deaerator for non-aqueous formulations. Used in wood and furniture coatings, parquet coatings, printing inks and overprint varnishes. It is recommended for... view more

TEGO® Airex 971 by Evonik is a silicon-free anti-foaming agent for radiation curing and non-aqueous formulations. It provides excellent compatibility and very fast foam breakdown. It is suitable for... view more

Aqueous solution of a copolymer with groups of high pigment affinity. Used as a wetting and dispersing additive for waterborne formulations in flexo and gravure inks, inkjet inks, pigment... view more

Tego® Flow ATF 2 is a flow/ leveling and anti-crater agent by Evonik. Exhibits outstanding effectiveness in high-solids formulations. Imparts very good slip effect, good flow promotion... view more

Polyether siloxane copolymer. Used as a flow/leveling and slip additive for waterborne, radiation-curing and solventborne formulations in overprint varnishes, silk screen inks, industrial coatings... view more

TEGO® Glide 466 by Evonik is a highly efficient slip and flow agent. It offers excellent anti-crating effect. It is designed for solvent-borne- and pigmented coatings. It is partly suitable for... view more

Solution of a modified special polyester in n-butyl acetate. Used in industrial coatings, silk screen inks and architectural coatings. Offers improved intercoat adhesion and corrosion protection... view more

Tego® Rad 2500 by Evonik acts as a slip agent and deaerator for radiation-curing formulations. Used in silk screen inks, flexo inks, wood and furniture coatings, overprint varnishes and coatings for... view more

Tego® Rad 2600 by Evonik acts as a cross-linkable release agent for radiation-curing formulations. Imparts good slip & defoaming effect and substrate wetting. Used in (litho) offset printing inks... view more

Silicone acrylate. Used as a release additive for radiation-curing formulations in offset printing inks, silk screen inks and overprint varnishes. Offers improved scratch resistance and marker... view more

Tego® Rad 2700 by Evonik acts as a release/ anti-blocking agent. Designed for radiation-curing formulations in (litho) offset printing inks, silk screen inks radiation-curing printing inks and... view more

TEGO® Variplus 3350 UV by Evonik is a solution of a special-purpose polyester resin. Used as a co-binder, a hard resin solution for radiation-curing formulations in flexo and gravure inks, silk screen inks... view more

Tego® Wet 260 by Evonik acts as a substrate wetting agent. Used for waterborne formulations in plastic coatings, automotive coatings, flexo and gravure inks, silk screen inks, industrial coatings... view more

Tego® Flow ZFS 460 by Evonik is a silicon-free, flow and leveling additive for solvent-borne and radiation curing formulations. It offers heat stable and good recoatability. It provides additional... view more

Tego® Foamex N by Evonik is a defoamer/deaerator for non-aqueous formulations. It offers utmost effectiveness against macro- and microfoam in solvent-borne, radiation-curing and high solids... view more