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The material selection platform
Coatings Ingredients
The material selection platform
Coatings Ingredients
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Products Compatible with SpectraRAY® F UVDE571

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.

CUREZOL®

Coatings ingredients supplied by Evonik

3 products match your search
Product Name
Supplier
Description
HSP Distance: 3.4
CUREZOL® 2E4MZ by Evonik is an imidazole curing agent for epoxy resins. It acts as an accelerator for dicyandiamide, anhydride. It is used as a phenolic curing agent in powder coatings. Recommended... view more
HSP Distance: 3.4
CUREZOL® 2MZ Azine by Evonik is an imidazole curing agent for epoxy resins. It acts as an accelerator for dicyandiamide. It is compatible with epoxy resins. It provides long latency and high heat... view more
HSP Distance: 3.4
CUREZOL® C17Z by Evonik is an imidazole curing agent for epoxy resins. It acts as an accelerator for dicyandiamide. It offers good latency & rapid reactivity at elevated temperatures. CUREZOL® C17Z... view more
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