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The material selection platform
Coatings Ingredients
The material selection platform
Coatings Ingredients
by SpecialChem
 
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53 products match your search
Product Name
Supplier
Description
DIC Corporation
Modified phenoxy resin. It has high molecular weight. Soluble in toluene, n-butanol, PGM-Ac (propylene glycol mono-methyl ether acetate) and xylene. Applications include baking finish... view more
DIC Corporation
Modified phenoxy resin. It has high molecular weight. Soluble in toluene, n-butanol, PGM-Ac (propylene glycol mono-methyl ether acetate) and xylene. Applications include baking finish... view more
DIC Corporation
Polyether-ester epoxy resin. It has high molecular weight. Soluble in MIBK (methyl isobutyl ketone), xylene and cyclohexanone. Applications include baking finish, can, and coil coatings... view more
DIC Corporation
Phenoxy resin. It has high molecular weight. Soluble in xylene, n-butanol and cyclohexanone. Applications include baking finish, can, and coil coatings... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in PCM (pre-coated metal), baking finish, can, and... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin diluted in xylene and cyclohexanone. It exhibits excellent workability. Available in Asian countries. Applications include can, coil, pre-coated metal (PCM), and... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in PCM (pre-coated metal), baking finish, can, and... view more
DIC Corporation
Epoxy phenol novolac. It is a multi-functional resin produced by reaction of phenol with formaldehyde and subsequent glycidylation with epichlorohydrin. Exhibits high heat resistance. Used in... view more
DIC Corporation
Modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. Used in non-solvent based coatings... view more
DIC Corporation
Modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. Used in non-solvent based coatings... view more
DIC Corporation
Epoxy resin based on tetra-bromo bisphenol A (BPA). It acts as a fire retardant. This brominated epoxy resin offers excellent fire retardancy. Applications include powder coatings... view more
DIC Corporation
Epoxy resin based on tetra-bromo bisphenol A (BPA). It acts as a fire retardant. This brominated epoxy resin offers excellent fire retardancy. Applications include powder coatings... view more
DIC Corporation
Polyamine (amide amine). Acts as a curing agent. Offers high strength. Suitable for low temperature applications. Applications include non-solvent based, floor, and concrete coatings... view more
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