Bisphenol A type (BPA) epoxy resin. It is a liquid resin which exhibits low tendency to crystallize. Available in Asian countries. Used in non-solvent based coatings. Applications include flooring... view more

Bisphenol A type (BPA) epoxy resin. It is a liquid resin comprising low content of hydrolyzable chlorine. Used in non-solvent based and cationic ED (electro-deposition) coatings. Applications... view more

Epoxy resin diluted with butyl glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Used in non-solvent based coatings. Applications include... view more

Epoxy resin diluted with alkyl phenol mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Used in non-solvent based coatings... view more

Bisphenol A type (BPA) epoxy resin. It is a semi-solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in resist inks, shipbuilding, and heavy duty... view more

Bisphenol A type (BPA) epoxy resin diluted in xylene. It is formed by reacting epichlorohydrin with bisphenol A followed by dilution in xylene. Exhibits excellent workability. Available in Asian... view more

Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A to form diglycidyl ethers of bisphenol A. Available in Asian countries. Used in hybrid... view more

Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A to form diglycidyl ethers of bisphenol A. Available in Asian countries. Used in hybrid... view more

Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A to form diglycidyl ethers of bisphenol A. Available in Asian countries. Used in hybrid... view more

EPICLON® B-570-H by DIC Corporation is methyl tetra-hydrophthalic anhydride. Used as a curing agent. Reacts with liquid resins during film forming process to give hard, insoluble films. Exhibits... view more

Epoxy resin diluted with alkyl phenol mono-glycidyl ether and alkyl mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Used in... view more

Epoxy resin diluted with 1, 6-hexanediol diglycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Used in non-solvent based coatings... view more

Phenoxy resin. It has high molecular weight and is soluble in cyclohexanone. Applications include baking finish, can, and coil coatings... view more

Phenoxy resin. It has high molecular weight. Applications include anti-corrosive, baking finish, can, and coil coatings... view more

EPICLON® EXA-4816 by DIC Corporation is an epoxy resin with high purity designed for flooring material coatings. Acts as a fast curing agent. Offers excellent flexible toughness, high strength and... view more

Polyether ester epoxy resin. It is a polyol resin. Soluble in MIBK (methyl isobutyl ketone) and toluene. Used for heavy-duty (anti-corrosive) and shipbuilding coatings... view more

Polyether ester epoxy resin. It is a polyol resin. Soluble in MIBK (methyl isobutyl ketone) and MEK (methyl ethyl ketone). Used for heavy-duty (anti-corrosive) and shipbuilding coatings... view more

Bisphenol F type epoxy resin. It is a resin of high purity. Exhibits excellent workability and moldability due to low viscosity. Used in non-solvent based coatings. Applications include... view more

EPICLON® EXA-835LV is a highly pure bisphenol-F type epoxy resin by DIC Corporation. Exhibits excellent workability and moldability due to low viscosity. Used in non-solvent-based coatings... view more

Modified phenoxy resin. It has high molecular weight. Soluble in PGM-Ac (propylene glycol mono-methyl ether acetate) and xylene. Applications include baking finish and coil coatings... view more