Epoxy resin. It is a non-volatile, polyfunctional resin. Provides rapid cure. Used in powder coatings... view more

Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in baking finish, can, coil, powder, shipbuilding... view more

Bisphenol A type (BPA) epoxy resin diluted in xylene, n-BuOH (n-butanol) and butyl cellosolve. Exhibits excellent workability. Available in Asian countries. Applications include can, coil... view more

EPICLON® 830 is bisphenol-F type epoxy resin by DIC Corporation. Used in non-solvent-based coatings including shipbuilding, heavy duty (anti-corrosive), floor, and concrete coatings. EPICLON® 830 is... view more

Bisphenol F type epoxy resin. It is a liquid resin containing low hydrolyzable chlorine content. Exhibits excellent workability and moldability due to low viscosity. Used in non-solvent based... view more

Bisphenol F type epoxy resin. It has low tendency for crystallization. Exhibits excellent workability and moldability due to low viscosity. Used in non-solvent based coatings. Applications include... view more

Bisphenol A type (BPA) epoxy resin. It is a liquid resin of low viscosity. Used in non-solvent based and cationic ED (electro-deposition) coatings. Applications include shipbuilding, heavy duty... view more

Bisphenol A type (BPA) epoxy resin. It is a liquid resin comprising low hydrolyzable chlorine. Used in non-solvent based and cationic ED (electro-deposition) coatings. Applications include... view more

Bisphenol A type (BPA) epoxy resin. It is a liquid resin. Used in non-solvent based and cationic ED (electro-deposition) coatings. Applications include shipbuilding, heavy duty (anti-corrosive)... view more

Bisphenol A type (BPA) epoxy resin. It is a distilled resin of high purity. Used in non-solvent based and cationic ED (electro-deposition) coatings. Applications include shipbuilding, heavy duty... view more

Bisphenol A type (BPA) epoxy resin. It is a liquid resin which exhibits low tendency to crystallize. Available in Asian countries. Used in non-solvent based coatings. Applications include flooring... view more

Bisphenol A type (BPA) epoxy resin. It is a liquid resin comprising low content of hydrolyzable chlorine. Used in non-solvent based and cationic ED (electro-deposition) coatings. Applications... view more

Epoxy resin diluted with butyl glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Used in non-solvent based coatings. Applications include... view more

Epoxy resin diluted with alkyl phenol mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Used in non-solvent based coatings... view more

Bisphenol A type (BPA) epoxy resin. It is a semi-solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in resist inks, shipbuilding, and heavy duty... view more

Bisphenol A type (BPA) epoxy resin diluted in xylene. It is formed by reacting epichlorohydrin with bisphenol A followed by dilution in xylene. Exhibits excellent workability. Available in Asian... view more

Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A to form diglycidyl ethers of bisphenol A. Available in Asian countries. Used in hybrid... view more

Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A to form diglycidyl ethers of bisphenol A. Available in Asian countries. Used in hybrid... view more

Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A to form diglycidyl ethers of bisphenol A. Available in Asian countries. Used in hybrid... view more

EPICLON® B-570-H by DIC Corporation is methyl tetra-hydrophthalic anhydride. Used as a curing agent. Reacts with liquid resins during film forming process to give hard, insoluble films. Exhibits... view more