ANCAMIDE® 3011 by Evonik is a high viscosity polyamide. It acts as a curing agent for solid epoxy resins. It offers high performance corrosion resistance, good flexibility and long pot life... view more

ANCAMIDE® 3015 by Evonik is a high viscosity polyamide solution in xylene. It acts as a curing agent for solid epoxy resins. This can be used in combination with solid epoxy resin solution in the... view more

ANCAMIDE® 3021 by Evonik is a medium viscosity polyamide. It is recommended for use with liquid epoxy resin. It offers good adhesion to cementitious substrates. ANCAMIDE® 3021 is suitable for use in... view more

ANCAMIDE® 3023 by Evonik is low viscosity polyamide supplied at 70% solids in xylene. It acts as a curing agent. It offers long pot life. ANCAMIDE® 3023 is recommended for two-component corrosion... view more

ANCAMIDE® 3030 by Evonik acts as a curing agent. It is reactive polyaminoamide developed for use in liquid epoxy resins. It offers low viscosity, moderate pot life and good adhesion. ANCAMIDE® 3030... view more

ANCAMIDE® 3155 by Evonik is a modified, water-soluble polyaminoamide adduct hardener. It has ability to disperse in epoxy resins. It offers low viscosity and moderate drying speed. It acts as a... view more

ANCAMIDE® 3178 by Evonik is polyamide adduct supplied at 75% solids in xylene. It is recommended for use in liquid epoxy resins. It acts as a curing agent. It provides good compatibility with liquid... view more

ANCAMIDE® 3201 by Evonik is a polyaminoamide adduct-based curing agent. It possesses low viscosity. It is an accelerated version of Ancamide® 3200 and is recommended for use with liquid epoxy resin... view more

ANCAMIDE® 3216 by Evonik is polyaminoamide in xylene. It acts as a curing agent. It is recommended for use with solid epoxy resins. It offers fast drying speed, high humidity resistance and good... view more

ANCAMIDE® 3301 by Evonik is a polyaminoamide adduct hardener. It offers excellent compatibility with epoxy resin. It acts as a curing agent. It provides excellent corrosion resistance and no... view more

Amidoamine. Acts as a low viscosity curing agent designed for use with liquid epoxy resin. Offers low viscosity, long pot life and high temperature performance. Its recommended usage level with... view more

ANCAMIDE® 3507 by Evonik is polyamide adduct. It acts as a curing agent. It shows good epoxy resin compatibility. It offers good corrosion resistance, excellent adhesion, high flexibility and good... view more

ANCAMIDE® 350A by Evonik is an epoxy curing agent. It offers low viscosity, high imidazoline content and long pot life with liquid resins. It is used in high solids coatings. ANCAMIDE® 350A has a... view more

ANCAMIDE® 351A by Evonik acts as a curing agent for use in epoxy-based coatings. Provides very good corrosion resistance and superior adhesion properties. Offers good color and light stability. Used... view more

ANCAMIDE® 3537 by Evonik is an accelerated polyamide adduct supplied in 4:1 xylene and butanol blend. It acts as a curing agent. It exhibits long pot life and fast lacquer drying when used with... view more

ANCAMIDE® 3622 by Evonik is a polyaminoamide adduct supplied in 1:1 xylene and n-butanol solvent. It acts as a curing agent. It offers no induction time and rapid dry touch with solid epoxy resin... view more

Standard reactive polyamide. Acts as a curing agent for epoxy resins. Possesses low viscosity and high imidazoline content. Offers long pot life with liquid resins. Used in high-solids... view more

Low viscosity, reactive polyamide. Acts as a curing agent for use in liquid epoxy resins. Shows very good compatibility with epoxy resins, including Bisphenol F-types, without induction. Offers good... view more

Polyamide/epoxy adduct, supplied as a 60% solids by weight solution in xylene/nbutanol (4:1 by weight). Acts as a curing agent for solid epoxy resin. Offers improved compatibility, flow and... view more

ANCAMIDE® 500 is a low viscosity curing agent by Evonik. Suitable for use in liquid epoxy resins with ambient temperature or heat cure. It can be used as the sole curing agent or in a mixture with... view more