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The material selection platform
Coatings Ingredients
The material selection platform
Coatings Ingredients
by SpecialChem
 
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Products Compatible with WEAK ACID RED 2BE 200%, ACID RED 266

Based on HSP Distance

Products Compatibility & HSP Distance

Hansen Solubility Parameters (HSP) helps to predict the compatibility of ingredients.

It is based upon the “like seeks like” principle. It splits an ingredients interactions into three parameters :
- δD (Dispersion force interactions)
- δP (Polar forces interactions)
- δH (Hydrogen bond force interactions).

If ingredients have matching HSP’s (distance=0) then they will be completely compatible. If there is a small distance between them then they are predicted to have good but not perfect compatibility. As the HSP distance gets larger the ingredients will become more incompatible.

In general, ingredients having an HSP distance below 2 will have good compatibility. Between 2 and 4, you will have medium compatibility. Above 4, you will have limited to no compatibility.

Most HSP values used to calculate the distance are estimates. Information provided below is to be used as an indication of compatibility.

Omicure™

Coatings ingredients supplied by Huntsman

13 products match your search
Product Name
Supplier
Description
Aliphatic Bis Urea, a Micronized cycloaliphatic substituted urea. Reduces time and temperature of curing. Provides long room temperature shelf life to epoxy/dicy formulations. Used as a latent... view more
HSP Distance: 0
Non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. Offers good oxidation aging and improved high temperature performance. Possesses low toxicity/less irritating and low cure temperature... view more
HSP Distance: 0
Omicure™ DDA 10 by Huntsman acts as a curing agent for epoxy resins in powder epoxy coatings. It is a micronized dicyandiamide. It can be catalyzed with other latent accelerators. Omicure™ DDA 10 provides... view more
HSP Distance: 0
Unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Primarily designed for use in solvent-based compositions. Compatible with all epoxy resins, including Bisphenol A and F... view more
HSP Distance: 0
Omicure™ DDA 5 by Huntsman acts as a curing agent that provides good dispersion, prevents settling and maximizes reactivity. It is an ultra-micronized grade of dicyandiamide. It contains... view more
HSP Distance: 0
Semi-Micronized dicyandiamide. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F... view more
HSP Distance: 0
Monuron N-(4-Chlorophenyl) - N, N-Dimethyl Urea, an aromatic substituted urea. Shows a long latency in formulated systems containing Dicy and epoxy. Suggested use levels < 5 phr. Used as a latent... view more
HSP Distance: 0
Phenyl Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Most similar in structure to Monuron and Diuron. Does not contain any chlorine. Used as a latent... view more
HSP Distance: 0
Micronized aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured properties in epoxy/dicy formulations. Used as a... view more
HSP Distance: 0
Aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured properties to epoxy/dicy formulations. Used as a latent... view more
HSP Distance: 0
Omicure™ U-52M by Huntsman is a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings. It is a micronized aromatic substituted urea. It reduces time and temperature of... view more
HSP Distance: 2.0
Omicure™ U-24M by Huntsman is a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings. It is a Micronized aromatic substituted urea. It can reduce the time and temperature of... view more
HSP Distance: 2.0
Toluene Bis Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Provides great degree of acceleration to epoxy/dicy formulations. Used as a latent... view more
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