2-Ethylhexyl acrylate. It is a transparent, colorless, clear liquid. It can be copolymerized for instance with acrylic acid and its salts, esters and acrylamide, with methacrylic acid... view more

Bakelite® PF 7835 LB Resin by Hexion is a tough, resilient phenolic resin. Acts as a crosslinking agent for polyester and acrylic based container coatings. Suitable for the production of coatings... view more

EPIKURE™ Curing Agent 8546-W-55 by Hexion is a low odor, water dilutable, shear stable, modified polyamine adduct. Designed for formulating ultra-low VOC, water-borne coatings. It can be combined... view more

EPOSIL™ Resin 5550 by Hexion is a siloxane modified hybrid epoxy resin for protective topcoats. It can be cross-linked by amine and amino-silane curing agents. It provides excellent chemical... view more

Non-ionic, aqueous dispersion of a bisphenol A epoxy resin with no organic solvents. Possesses moderate viscosity and mechanical stability. Exhibits high epoxy functionality, good chemical and water... view more

Non-ionic, aqueous dispersion of a bisphenol A epoxy resin with no organic solvents. Possesses moderate viscosity and mechanical stability as well as high epoxy functionality. Provides good water... view more

Dispersion of an EPON™ Resin 1001F in water and 2-propoxyethanol. Offers high gloss and very good stability. Is insensitive to pH, accepts variety of pigments, nonsettling or creaming on storage... view more

Nonionic, aqueous dispersion of a solid bisphenol A epoxy resin. Has moderate viscosity and is mechanically stable. Used in electrical dip coatings and varnishes. Can also be used in formulations... view more

Nonionic stable dispersion of high molecular weight bisphenol A resin. Offers good adhesion to steel or aluminum. Compatible with a variety of aminoplast resins and stable with a wide range of... view more

Low VOC and non-HAPS, physically stable, dispersion of EPON™ Resin 1007 in water and methoxy propanol. Offers good adhesion to metal and glass. May also be used to modify ambient cure epoxy resin... view more

Nonionic, aqueous dispersion of urethane modified epoxy resin. Has a moderate viscosity and is mechanically stable. Used in electrical dip coats and varnishes. May also be incorporated in... view more

Polyfunctional epoxy resin dispersion. Has rapid room temperature cure and low volatile organic content (VOC). Offers good paint stability, performance versatility, long-term water and humidity... view more

Dispersion of an epoxidized ortho-cresylic novolac. Contains no organic cosolvents and no VOC. Has high functionality as well as temperature stability. Offers good chemical and abrasion resistance... view more

Non-ionic aqueous dispersion of a modified EPON™ Resin 1001 type solid Bis A epoxy. Has ultra low VOC, mechanical stability, no induction time and very fast dry and recoat times. Is... view more

EPI-REZ™ Resin 6521-WH-56 by Hexion is a label-free, low volatile organic compound (VOC) epoxy resin with wet-on-wet recoating options. Exhibits good flexibility, very low co-solvent levels (2.5%)... view more

EPI-REZ™ Resin 6531-WH-57 by Hexion is a label-free, low volatile organic compound (VOC) faster drying epoxy resin with wet-on-wet recoating options. Exhibits high hardness, good flexibility, very... view more

EPI-REZ™ Resin 7520-WD-52 by Hexion is an environment-friendly, cost-effective, high performance epoxy resin dispersion. Exhibits corrosion resistance and substrate adhesion. Suitable for use in... view more

Epi-rez™ Resin 7720-W-50 by Hexion is an odorless, non-ionic, waterborne epoxy dispersion based on a modified EPON™ Resin 1001-type solid epoxy resin. This non-flammable and non-combustible resin... view more

Epi-rez™ Resin 7723-W-53 by Hexion is a VOC-free, co-solvent free, solid epoxy resin dispersion. Offers self-coalescence, good film formation and excellent adhesion on various substrates. Exhibits... view more

Liquid, bisphenol A type epoxy resin. As a binder it is useful for trowel applied floor toppings, bond coats, base coats and membranecoatings. Can also be combined with ECO-CRYL™ acrylic resin... view more

Water dispersible, high viscosity, bisphenol A type epoxy resin. As a binder for trowel applied floor toppings, as bond coats, base coats, membrane coatings. Forms a fine particle dispersion of... view more

Epi-rez™ System 4230-W-60 is a VOC-free, one-pack, epoxy phenolic novolac co-dispersion by Hexion. It is a ready to use, water-borne binder and promotes wetting and adhesion to various substrates... view more

Low viscosity epoxy resin based on a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and epichlorohydrin) as well as... view more

An accelerated low viscosity epoxy resin based of a bisphenol A resin (produced from bisphenol A and epichlorohydrin), containing an added proportion of a modification agent. Offers very good curing... view more

Epikote™ Resin 1001-X-75 by Hexion is a 75% solids solution in xylene based on epichlorohydrin and bisphenol-A. Exhibits good corrosion protection and water resistance. Used for solvent-borne 2-pack... view more

Medium viscosity epoxy resin based on a blend of a bisphenol F resin (produced from bisphenol F and epichlorohydrin) and a bisphenol A resin (produced from bisphenol A and epichlorohydrin). Has a... view more

Epikote™ Resin 154 by Hexion is a polyfunctional epoxy phenol novolac resin. Imparts very good dimensional stability, high temperature as well as chemical resistance. Epikote™ Resin 154 is used in... view more

Polyfunctional epoxy phenol novolac resin. Imparts very good dimensional stability, high temperature resistance as well as high chemical resistance. Used in high performance coatings... view more

Low viscosity epoxy resin produced from bisphenol A and epichlorohydrin, and containing an added proportion of cresyl glycidyl ether as reactive diluent. Provides good pigment wetting and good... view more

Low viscosity epoxy resin produced from bisphenol A and epichlorohydrin, and containing an added proportion of a mono-epoxidised alcohol as a reactive diluent. Possesses low volatility as wel as... view more

Diluent-free, low-medium viscosity epoxy resin consisting of a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and... view more

Diluent-free, low-medium viscosity epoxy resin consisting of a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and... view more

Diluent-free, low-medium viscosity epoxy resin consisting of a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and... view more

Epikote™ Resin 240 is a low viscosity epoxy resin based on a blend of a bisphenol A resin (bisphenol A and epichlorohydrin) and a bisphenol F resin (bisphenol F and epichlorohydrin). Exhibits low... view more

Low viscosity epoxy resin, based on a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and epichlorohydrin) as well as... view more

Low viscosity epoxy resin, based on a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and epichlorohydrin. Possesses... view more

Low viscosity epoxy resin, based on a blend of a bisphenol A resin (produced from bisphenol A and epichlorohydrin) and a bisphenol F resin (produced from bisphenol F and epichlorohydrin. Possesses... view more

Moderate viscosity, non-ionic, aqueous dispersion of a bisphenol A epoxy resin. Offers good chemical and water resistance properties. Has high epoxy functionality. Is water reducible, providing wide... view more

Solid dispersion of EPIKOTE Resin 1001 in water and 2-propoxyethanol. Imparts high gloss, very good stability. Is insensitive to pH and mechanically stable. Used in waterborne and two-package... view more

Nonionic stable dispersion of high molecular weight Bisphenol A resin. Imparts good adhesion to steel or aluminum. When cross-linked with an appropriate melamine or urea-formaldehyde resin and... view more

Low viscosity epoxy resin based on a blend of a bisphenol F resin (produced from bisphenol F and epichlorohydrin) and a bisphenol A resin (produced from bisphenol A and epichlorohydrin) as well as... view more

Nonionic, aqueous dispersion of urethane modified epoxy resin. Has a moderate viscosity and is mechanically stable. Is completely water reducible, providing wide latitude for viscosity reduction... view more

Polyfunctional epoxy resin dispersion. Offers good paint stability, performance versatility, long-term water and humidity resistance. Provides corrosion resistance over a variety of substrates and... view more

Epoxidized ortho-cresylic novolac dispersion. Is high functionality resin with no VOC. Offers high temperature stability, good chemical and abrasion resistance as well as superior hydrolytic... view more

Non-ionic aqueous dispersion of a modified EPIKOTE™ Resin 1001 type solid Bis A epoxy. Exhibits good compatibility with many water-reducible amine curing agents. Has very low odor, ultra low VOC and... view more

Epikote™ Resin 816 by Hexion is a low viscosity epoxy resin produced from bisphenol A and epichlorohydrin. Exhibits low volatility, mild odor and a moderate resistance to crystallization on storage... view more

Very low viscosity epoxy resin produced from bisphenol A and epichlorohydrin. Has low volatility, very good pigment/filler and substrate wetting as well as good resistance to crystallization... view more

Low viscosity epoxy resin produced from bisphenol A and epichlorohydrin. Has low volatility, very good pigment/filler and substrate wetting as well as good resistance to crystallization. Imparts a... view more

Low viscosity epoxy resin produced from bisphenol A and and F resins diluted with CARDURA™ E10P as a reactive diluent. Offers good pigment and filler wetting properties, good mechanical performance... view more

Epikote™ Resin 827 by Hexion is a medium viscosity liquid epoxy resin produced from bisphenol A resin and epichlorohydrin. Provides good pigment wetting and good resistance to filler settling... view more

Epikote™ Resin 828 by Hexion is a medium viscosity liquid epoxy resin produced from bisphenol A and epichlorohydrin. Provides good pigment wetting, good resistance to filler settling, a high level... view more

Medium viscosity liquid epoxy resin produced from bisphenol A and epichlorohydrin. Contains no diluent. Provides good pigment wetting, good resistance to filler settling, a high level of mechanical... view more

Medium viscosity epoxy resin produced from bisphenol A and epichlorohydrin. Contains no diluent. Provides good pigment wetting, good resistance to filler settling and a high level of mechanical as... view more

Epikote™ Resin 834 is a high viscosity liquid epoxy resin produced from bisphenol A and epichlorohydrin. It contains no diluent. Imparts good corrosion protection and water resistance. Epikote™... view more

High viscosity liquid epoxy resin. Contains no diluent. Imparts good corrosion protection and good water resistance. Used for heavy duty and protective coatings... view more

High viscosity liquid epoxy resin. Contains no diluent. Imparts good corrosion protection and good water resistance. Used for heavy duty and protective coatings... view more

Epoxy resin produced from bisphenol A and epichlorohydrin. Contains no diluent. Has good compatibility with other film formers and contributes the level of film performance associated with the... view more

Epoxy resin produced from bisphenol A and epichlorohydrin. Contains no diluent. Has good compatibility with other film formers and contributes the level of film performance associated with the... view more

Epikote™ Resin 862 by Hexion is a low viscosity epoxy resin produced from bisphenol F and epichlorohydrin. Provides good pigment wetting and good resistance to filler settling. Epikote™ Resin 862... view more

An epoxy resin, which has been produced from bisphenol A, epichlorohydrin and a flexibilizing coreactant. Offers good resistance to water and many chemicals although this is lower than that of... view more

An epoxy resin, which has been produced from bisphenol A, epichlorohydrin and a flexibilizing coreactant. Offers good resistance to water and many chemicals although this is lower than that of... view more

An epoxy resin derived from bisphenol A and epichlorohydrin. Imparts good corrosion protection and water resistance. Typical end-uses include the protection of steel and concrete. Both primers and... view more

Bisphenol-A based epoxy resin solution. Has very good flexibility and corrosion resistance. Used in high solids, ambient cure epoxy coatings and is suitable for use in either epoxy primers or... view more

Special curing agent based on a Mannich base for the application under water or on wet concrete. Offers very good water resistance and adhesion under wet conditions. Provides good mechanical... view more

Low viscosity, modified cycloaliphatic amine. Acts as a curing agent for liquid epoxy resins at ambient curing temperatures. Offers a high resistance against the formation of blisters or so called... view more

High-viscosity, mannich base hardener. Acts as a curing agent for use in combination with liquid epoxy resins at ambient temperatures. Offers a high level of chemical resistance. Exhibits good... view more

Low viscosity, modified polyamine hardener for chemical resistant systems. Offers high chemical resistance. Shows a high mechanical strength and a high heat deformation temperature of approximately... view more

Low viscosity, dark color, amidoamine based on tall oil fatty acid and polyamines. Acts as a curing agent. Possesses low imidazoline content. Offers moderately fast-setting, and moderate pot life... view more

Very low viscosity amidoamine based on tall oil fatty acid and polyamines. Acts as a curing agent. Offers moderately fast setting. Exhibits very good compatibility with epoxy resin and co-curing... view more

Moderate-viscosity, modified amidoamine adduct. Provides very good blush, water and corrosion resistance. Offers strong adhesion to damp or underwater substrates, including concrete and steel... view more

High molecular weight, reactive polyamide, based on dimerized fatty acid and polyamines. Acts as a curing agent. Offers very good water and corrosion resistance. Provides good adhesion and pigment... view more

Epikure™ 3115 by Hexion is a high molecular weight, reactive polyamide based on dimerized fatty acid and polyamines. Acts as a curing agent for solid epoxy resins. Offers very good water and... view more

High molecular weight, reactive polyamide based on dimerized fatty acid and polyamines. Acts as a curing agent for solid epoxy resins. Offers very good water and corrosion resistance. Provides very... view more

Epikure™ 3115-X-70 by Hexion is a solution in xylene of a high molecular weight, reactive polyamide based on dimerized fatty acid and polyamines. Acts as a curing agent for solid epoxy resins... view more

Epikure™ 3125 by Hexion is a medium viscosity, highly reactive polyamide based on dimerized fatty acid and polyamines. Acts as a general purpose curing agent for epoxy resins. Offers very good... view more

Epikure™ 3140 is a low viscosity reactive polyamide, imidazoline, based on dimerized fatty acids and polyamines. Acts as a moderate molecular weight epoxy curing agent. Imparts good chemical and... view more

Low viscosity, modified polyamide based on dimerised fatty acid and polyamines. Acts as an epoxy curing agent. Offers good flexibility. Provides very good corrosion resistance. Possesses good blush... view more

Modified polyamide. Acts as a curing agent designed for use with epoxy resins to formulate high solids, two component, ambient-cure coatings. Possesses rapid cure response. Offers good working pot... view more

Polyamide adduct. Acts as an epoxy curing agent. Offers very good corrosion resistance. Provides reduced induction times. Imparts low moisture sensitivity. Shows good epoxy resin compatibility. Used... view more

Modified polyamide supplied at 100 percent solids. Acts as a curing agent designed for use with liquid epoxy resins in formulating high-solids, high-build coatings. Exhibits very good chemical... view more

Unmodified Aliphatic Amine. Acts as an epoxy curing agent. Possesses the tendency to form complexes with atmospheric carbon dioxide, particularly in humid conditions, due to which they are... view more

Aliphatic amine adduct in a mixture of xylene, propylene glycol monomethyl ether and methyl isobutyl ketone. Acts as a curing agent designed for two-component epoxy coatings. Offers good chemical... view more

Unmodified Aliphatic Amine. Acts as an epoxy curing agent. Possesses the tendency to form complexes with atmospheric carbon dioxide, particularly in humid conditions, due to which they are... view more

Unmodified Polyoxypropylenediamine. Acts as a difunctional primary amine curing agent. Possesses moderate reactivity, low viscosity, low color, low vapor pressure and high primary amine content... view more

Polyoxypropylenetriamine. Acts as a primary amine curing agent. Offers low viscosity and low vapor pressure. Provides light color and improved color retention. Exhibits long pot life and improved... view more

Unmodified Aliphatic Amine. Acts as an epoxy curing agent. Possesses the tendency to form complexes with atmospheric carbon dioxide, particularly in humid conditions, due to which they are... view more

Unmodified Aliphatic Amine. Acts as an epoxy curing agent. Possesses the tendency to form complexes with atmospheric carbon dioxide, particularly in humid conditions, due to which they are... view more

Phenol-free, modified Mannich base epoxy curing agent. Provides fast setting, low temperature cure and chemical resistance. Offers very good moisture resistance. Exhibits high gloss, and carbonate... view more

Accelerated long chain length aliphatic polyamine. Acts as a low viscosity, moderately fast-setting epoxy curing agent. Offers high tensile strength, elongation and tear resistance. Provides very... view more

Modified aliphatic amine. Acts as a curing agent for epoxy resin formulations at temperatures of 60 °F (15 °C) and above. Offers resistance to amine carbonate formation (“blush”, “bloom” or... view more

Modified aliphatic amine. Acts as a low to moderate viscosity, fastsetting, high-temperature resistant epoxy curing agent. Offers very good chemical resistance. Provides modest blush resistance... view more

Modified aliphatic amine, supplied at 100 percent solids. Acts as a curing agent designed for use with epoxy polyacrylate resins in formulating high solids, high build coatings. Provides low... view more

Moderately reactive, low viscosity, aliphatic amine. Acts as a water-insensitive curing agent for epoxy compositions in high humidity environments. Resists blushing, bloom, and sweat-out in epoxy... view more

Moderately reactive curing agent for epoxy resins. Exhibits low viscosity and water insensitivity. Resists “blushing” and “sweat-out” even under high humidity conditions. Used for systems designed... view more

Very reactive, modified aliphatic amine adduct. Acts as a curing agent. Offers relatively short cure periods at room temperature. Used for tooling gel coats, and laminating compounds... view more

High molecular weight amine adduct supplied at 60% non-volatiles in butanol/xylene. Acts as a curing agent designed for use in two-package, air-dry epoxy coatings. Offers high resistance to water... view more

Very low viscosity aliphatic amine adduct. Act as a curing agent for epoxy resins at room or moderately elevated temperatures, and also for aqueuos resin systems. Offers reduced vapor pressure, less... view more

Very low viscosity, light colored cycloaliphatic amine. Act as a curing agent for epoxy resins. Yields epoxy systems with relatively high heat distortion properties when properly cured. Offers... view more

Low viscosity, modified cycloaliphatic amine. Act as a curing agent for epoxy resin systems at normal room temperatures. Offers good overnight cure development. Provides a high degree of chemical... view more

Relatively low viscosity, modified amine adduct. Act as a light colored epoxy curing agent for epoxy resin systems under low-temperature and high humidity conditions. Offers good through-cure at low... view more

Very low viscosity, modified cycloaliphatic amine. Acts as a light colored epoxy curing agent. Offers very good chemical and corrosion resistance. Provides very good gloss and color stability... view more

Very low viscosity, modified cycloaliphatic amine. Acts as a light colored epoxy curing agent. Offers good flexibility. Provides very good gloss and color stability. Possesses good chemical... view more

Very low viscosity, modified cycloaliphatic amine adduct. Acts as a curing agent for epoxy resins. Offers good resistance to blush or "sweat-out". Provides very good color. Possesses good chemical... view more

Low viscosity, modified cycloaliphatic amine adduct. Acts as a light colored epoxy curing agent. Offers good chemical resistance and good blush resistance. Provides high gloss, smooth, and... view more

Low viscosity, light colored cycloaliphatic amine. Acts as a curing agent for epoxy resins at room temperature. Offers very good resistance to blush or "sweat-out". Provides high reactivity at room... view more

Low viscosity, low color, modified cycloaliphatic amine. Acts as an epoxy curing agent. Offers very good corrosion and chemical resistance. Provides good amine-blush resistance. Exhibits good color... view more

Low viscosity Ketimine. Reaction product of ethylenediamine and methyl isobutyl ketone. Acts as a curing agent. Imparts extended pot life of 7-8 hours to high solids coatings. Used for high solids... view more

Light color, low viscosity, modified cycloaliphatic amine. Acts as a curing agent for liquid epoxy resins. Offers low yellowing characteristics. Provides very good surface appearance and blush... view more

Light color, low viscosity, modified cycloaliphatic amine. Acts as a curing agent for liquid epoxy resins. Offers good mechanical properties. Provides good water spot resistance. Exhibits very good... view more

Epikure™ 6870-W-53 by Hexion is a solvent-free, 53% solids, non-ionic aqueous dispersion of a modified polyamine adduct. Acts as a high molecular weight curing agent for epoxy resins. Designed to... view more

Water-reducible amine adduct supplied at 60% nonvolatiles in 2-propoxyethanol. Acts as a curing agent for formulating two component, chemically resistant water reducible epoxy coatings. Exhibits... view more

Modified polyamidoamine adduct supplied at 50 % solids in water. Acts as a curing agent. Offers combination of hardness, flexibility, and solvent resistance. Provides no flash rusting, very good... view more

Modified polyamidoamine adduct. Acts as a curing agent for use in the formulation of two component, water reducible epoxy coatings. Possesses a high level of chemical and corrosion resistance... view more

Water reducible amine adduct supplied at 60 percent solids in water, 2-propoxyethanol and glacial acetic acid. Acts as a curing agent. Possesses very good early water spot and wash-off resistance... view more

Modified polyamidoamine adduct. Acts as a curing agent in the formulation of two-component, water reducible epoxy coatings. Offers good corrosion and water resistance. Provides high initial gloss... view more

Epikure™ Curing Agent 580 by Hexion is a light color, lower viscosity, modified cycloaliphatic amine curing agent. It offers enhanced yellowing resistance, tack-free surfaces and excellent... view more

Glycol ether solution of non-ionic amine polymers. Acts as a curing agent. It is of low viscosity. It is an excellent pigment wetting agent or pigment grind vehicle. Provides outstanding corrosion... view more

Versatile, chemically stable, free flowing pulverized amine adduct. Acts as an ultra rapid curing agent especially designed to cure epoxy resin powder coatings at temperatures down to 250 °F (121... view more

An accelerated form of dicyandiamide. Acts as a catalytic type curing agent. Possesses good film appearance and a high level of film properties. Used in thick film decorative or functional powder... view more

An accelerated form of dicyandiamide. Acts as a catalytic type curing agent. Used in powder coatings and to prepare thin film decorative powders... view more

Phenolic hydroxyl terminated solid flaked curing agent. Contains 2-methylimidazole that functions as an accelerator to reduce the cure cycle. Available in package to minimize the moisture pick up... view more

Epoxy resin. Offers very good chemical resistance, corrosion resistance and low color. Used in formulating various room temperature curing industrial maintenance coatings including clears, primers... view more

Solution of EPON Resin 1001F cut to 75% weight in propylene glycol methyl ether (PGME). Used in solventborne amine or polyamide cured coatings and as a modifying resin in solventborne thermosetting... view more

Is a 65% solids solution of EPON Resin 1001F-type epoxy resin in tertiary-butyl acetate solvent (TBAC). Is zero VOC and non-HAPs. Has superior chemical resistance, corrosion resistance and low... view more

Solid resin solution of EPON Resin 1001F cut to 75% weight in methyl n-amyl ketone(Mn-AK). Offers good solubility. Used in solventborne amine or polyamide cured coatings... view more

Is a 75% solids solution of an EPON Resin 1001F type epoxy resin in Toluene. Offers very good chemical resistance, corrosion resistance and low color. Used in industrial maintenance coatings... view more

Epoxy resin in aromatic solvent 100 and 2-propoxyethanol. Offers very good chemical resistance, corrosion resistance and low color. Used in industrial maintenance coatings including clears, primers... view more

Epon™ Resin 1001-X-75 by Hexion is a low color, 75% solids solution of an EPON 1001F type epoxy resin in xylene. Offers very good chemical and corrosion resistance. Epon™ Resin 1001-X-75 is used in... view more

Low molecular weight solid epoxy resin derived from a liquid epoxy resin and bisphenol-A. Provides very good chemical resistance, toughness, durability and adhesion. Especially useful in maintenance... view more

Solid epoxy resin derived from a liquid epoxy resin and bisphenol-A. Offers good reactivity, rheology and electrical properties in powder coatings. Does not block or sinter even at slightly elevated... view more

2,2-bis(p-glycidyloxyphenyl) propane condensation product with 2,2-bis(p-hydroxyphenyl) propane and similar isomers. Provides special solution viscosity and reactivity properties when combined with... view more

Epon™ Resin 1007F is a moderately high molecular weight solid epoxy resin derived from a liquid epoxy resin and bisphenol-A. Provides outstanding flexibility, adhesion, very good resistance to... view more

Epon™ Resin 1009F by Hexion is a very high molecular weight, 2,2-bis(p-glycidyloxyphenyl) propane condensation product with 2,2-bis(p-hydroxyphenyl) propane and similar isomers. Exhibits outstanding... view more

Novolac-free multifunctional epoxy resin. Improves the properties of cured epoxy resin systems particularly at elevated temperatures. Increases the crosslink density of cured systems. Has greater... view more

Brominated epoxy resin with a moderate bromine content. Offers good sintering resistance at room temperature and moderate flammability resistance... view more

Multifunctional epoxy novolac resin. Offers low viscosity for corresponding functionality. Provides superior chemical resistance, batch-to-batch consistency and good thermal resistance. Used in... view more

Multifunctional epoxidized phenolic novolac resin. Offers high functionality and relatively low viscosity. Provides good thermal stability and chemical resistance. Used in chemically resistant... view more

Epon™ Resin 164 by Hexion is a solid multifunctional epichlorohydrin/ cresol novolac epoxy resin. Possesses low ionic contaminants and saponifiable chloride. Offers high thermal stability... view more

Solid multifunctional epichlorohydrin/cresol novolac epoxy resin. Possesses low ionic contaminants and saponifiable chloride. Offers high thermal stability, versatility, reactivity, chemical... view more

2,2-bis (p-glycidyloxyphenyl) propane condensation product with 2,2-bis (p-hydroxyphenyl) propane and similar isomers. Provides controlled and extended gelation time in epoxy powder coatings to... view more

Solid bisphenol A/epichlorohydrin epoxy resin. Possesses uniform properties from lot to lot, filtered to remove particulate contaminants, low in color, low in moisture, total volatiles content... view more

Phenol,4,4’-(1-methylethylidene)bis-,polymer with 2,2’-[(1-methylethylidene)bis (4,1-phenyleneoxmethylene)] bis[oxirane]. Is very stable under normal, low in moisture and total volatiles content... view more

Solid bisphenol A/epichlorohydrin epoxy resin. Provides consistent cure response. Has extremely low levels of hydrolyzable chlorine and uniform properties from lot to lot. Used in decorative powder... view more

Solid bisphenol A/epichlorohydrin epoxy resin. Possesses uniform properties from lot to lot, filtered to remove particulate contaminants, low in color, stable on storage, flows evenly, cures rapidly... view more

Low viscosity epoxy resin. Displays exceptionally rapid reaction rates with aliphatic amine curing agents over a broad temperature range. Possesses good wetting characteristics, strong bonding to... view more

Low viscosity liquid bisphenol-A based epoxy resin diluted with cresyl glycidyl ether. Reacts with full range of curing agents at low temperatures, produces high-strength cured systems resistant to... view more

100% reactive, low viscosity, liquid bisphenol-A based epoxy resin diluted with an alkyl glycidyl ether. Has minimum odor and good color. Can be cured or crosslinked with a variety of curing agents... view more

100% reactive, low viscosity, liquid bisphenol A based epoxy resin containing a commercial grade of n-butyl glycidyl ether. Reacts with a full range of curing agents. Provides minimal reduction of... view more

Moderate viscosity resin containing both epoxide and reactive unsaturation functionality. Offers very good substrate wetting. Has light color, low vapor pressure, high reactivity and good cured... view more

Liquid epoxy resin. Offers superior resistance to pigment and filler settling. Provides greater stability to highly-filled compounding formulations. Has a low level of monofunctional diluent ... view more

Low viscosity epoxy resin. Offers higher performance and crystallization resistance compared to alternative low viscosity, liquid epoxy resins. Exhibits very good wetting and adhesion to concrete as... view more

High purity, bisphenol A epichlorohydrin epoxy resin. Has low color and reactivity with a full range of curing agents. Offers greater clarity, chemical resistance, higher heat distortion temperature... view more

Epon™ Resin 826 is a low viscosity, light colored liquid bisphenol-A based epoxy resin by Hexion. It can reacts with a full range of curing agents. Exhibits low ionic contamination. Produces... view more

Epon™ Resin 828 by Hexion is an undiluted clear difunctional bisphenol-A/ epichlorohydrin derived epoxy resin. When cross-linked or hardened with appropriate curing agents, very good mechanical... view more

Low molecular weight epoxy resin. Has outstanding resistance to pigment and filler settling, which gives greater stability to filled systems. Also has superior resistance to foaming under vacuum as... view more

Epoxy resin. Offers very good resistance to pigment and filler settling. Has low saponifiable chlorine level and superior resistance to foaming under vacuum... view more

Slightly higher molecular weight BPA liquid epoxy. Offers very good resistance to crystallization and higher reactivity at room temperature. Has low color and good chemical resistance. Used in gel... view more

Semi-solid high molecular weight bisphenol A based epoxy resin. Provides enhanced system reactivity, surface tack and cured resin toughness in comparison to liquid grade BPA epoxies, but reduces... view more

Is a 90% weight solids solution of EPON Resin 834 epoxy resin in normal butyl alcohol (or n-butanol). Offers very good chemical and corrosion resistance. Its intermediate molecular weight offers... view more

Epoxy resin solution. Has very good chemical and corrosion resistance. Is amenable to high solids formulations due to low molecular weight and low viscosity as well as its characteristic film... view more

Epoxy resin solution. Has very good chemical and corrosion resistance. Is amenable to high solids formulations due to low molecular weight and low viscosity as well as its characteristic film... view more

Bisphenol-F/epichlorohydrin epoxy resin. Has low viscosity and low color. Reacts with a full range of epoxy curatives. Offers good balance of mechanical, adhesive, electrical properties and chemical... view more

Low viscosity, undiluted, difunctional epoxy resin produced from bisphenol-F (BPF) and epichlorohydrin. Provides good resistance to crystallization. Offers good balance of mechanical, chemical... view more

Chemically modified BPA based epoxy resin. Acts as the sole resin to provide varying degrees of flexibility and toughness... view more

Chemically modified BPA based epoxy resin. Acts as the sole resin to provide varying degrees of flexibility and toughness but reduces elevated temperature performance. Imparts good water resistance... view more

Bisphenol-A based epoxy resin. Offers improved flexibility, faster dry times and longer pot life than standard liquid epoxy resins. Has equivalent impact resistance, corrosion- and... view more

Blends of bisphenol A based liquid epoxy resin and C12-C14 alkyl glycidyl ether similar to EPON Resin 8132. Has low viscosity, low volatility, good wetting characteristics as well as chemical... view more

Blend of bisphenol A based liquid epoxy resin and C12-C14 alkyl glycidyl ether. Has low viscosity, low volatility, good wetting characteristics as well as chemical resistance... view more

Intermediate viscosity liquid bisphenol-A based epoxy resin modified with an aromatic glycidyl ether. Exhibits minimal property loss under a broad range of processing or exposure conditions. Has low... view more

Polymeric solid epoxy resin possessing an average epoxide group functionality around eight. Imparts improved high temperature strength, thermal stability, reactivity and chemical resistance. Used... view more

Eponex™ Resin 1510 is a low viscosity and high molecular weight epoxy resin. Offers improved yellowing and chalking resistance as well as very good profile of mechanical properties. Eponex™ Resin... view more

An ultra high molecular weight epoxy resin. Used in one package preconstruction shop primers and in high performance baking finishes... view more

Diglycidyl ether of cyclohexane dimethanol. Acts as a viscosity depressant. Improves air release and wetting characteristics. Improves cured system flexibility and surface tension. Provides... view more

2-ethylhexyl glycidyl ether. Acts as a viscosity depressant. It is a low viscosity, almost colorless monoepoxide. Improves the substrate and filler wetting of conventional formulations. Improves... view more

Non-volatile, low viscosity polyepoxide resin. Imparts the flexibility, impact resistance, water resistance and thermal shock resistance. Used in dip coating compounds... view more

Low molecular weight butyl glycidyl ether. Acts as a viscosity depressant. It is a virtually colorless monoepoxide. Offers very good retention of mechanical and chemical resistance cured state... view more

Low viscosity and low volatility aromatic monoepoxide. Reduces the viscosity of higher molecular weight aromatic epoxy resins. Offers very good retention of mechanical and chemical resistance cured... view more

Glycidyl ether of para-tertiary butyl phenol. Acts as moderately effective viscosity reducer for higher molecular weight aromatic epoxy resins. Is particularly useful in epoxy applications requiring... view more

Diglycidyl ether of 1, 4-butanediol. Acts as a viscosity depressant. Improves air release and wetting characteristics. Improves cured system flexibility and surface tension. It is compatible with... view more

Diglycidyl ether of neopentyl glycol. Acts as a viscosity depressant. Improves air release and wetting characteristics. Improves cured system flexibility and surface tension. It is compatible with... view more

Aliphatic monoglycidyl ether containing alkyl chains which are predominately C12 and C14 in length. Acts as a viscosity reducing modifier of epoxy resin formulations in water reducible coatings... view more

Monoglycidyl ether of para-tertiary butyl phenol. Acts as a primarily reactive diluent or viscosity reducer. Offers good leveling, low volatility, surfaces and wetting properties... view more

Diglycidyl ether of 1,4-butanediol. Acts as a primarily reactive diluent or viscosity reducer. Offers good leveling, surfaces and wetting properties. Facilitates air release... view more

Diglycidyl ether of 1,6-hexanediol. Acts as a primarily reactive diluent or viscosity reducer. Offers good leveling, surfaces and wetting properties. Facilitates air release... view more

Monoglycidyl ether of o-cresol. Acts as a primarily reactive diluent or viscosity reducer. Offers good leveling, low volatility, surfaces and wetting properties... view more

Aliphatic monoglycidyl ether of C13/C15-fatty alcohol. Acts as a primarily reactive diluent or viscosity reducer. Offers good leveling, surfaces and wetting properties... view more

Polyfunctional glycidyl ether of trimethylolpropane. Acts as a primarily reactive diluent or viscosity reducer. Has low viscosity and low temperature curing. Reduces the viscosity but retains... view more

Heloxy™ Modifier Z8 is an aliphatic monoglycidyl ether of C12/C14-fatty alcohol by Hexion. Acts as a primarily reactive diluent or viscosity reducer. Heloxy™ Modifier Z8 shows good leveling... view more

Structured maleic modified rosin ester. Exhibits elastic behavior in conventional heatset and sheetfed varnish applica­tions. Offers good color for overprint applications... view more

VeoVa™ 10 is a vinyl ester of Versatic™ acid 10, a synthetic saturated monocarboxylic acid of highly branched structure containing ten carbon atoms. Imparts a combination of flexibility (medium to... view more

VeoVa™ 9 by Hexion is a vinyl ester of Versatic™ acid 9, a synthetic saturated monocarboxylic acid of highly branched structure containing ten carbon atoms. Designed for coatings applications... view more

Cycloaliphatic epoxy resin based on epoxidation of hydrogenated bisphenol A and other polyfunctional polyols. Readily mixes with modifiers, fillers, and liquid curing agents at room temperature... view more

C12-C13 Aliphatic monoglycidyl ether. Reduces viscosity of epoxy resin systems. Used for coatings for food contact... view more

Cyclohexane dimethanol diglycidyl ether. Reduces viscosity of liquid epoxy resins and exhibits relatively low volatility. Useful in 100% solids floor coatings... view more

Low toxicity, N,N-diglycidyl aniline. Used as a reactive diluent and as a modifier in 100% solids floor coatings. Offers low viscosity with minimal sacrifice in heat distortion and chemical... view more

N,N-Diglycidyl aniline. Reduces viscosity with minimal sacrifice in heat distortion and chemical resistance. Useful in 100% solids floor coatings... view more

Resorcinol diglycidyl ether. Provides low viscosity formulations with highest heat distortion and chemical resistance available. Recomended for high performance 100% solids coatings applications... view more

Polyamide in Xylene solution. Shows good adhesion, toughness and water resistance. Used for general purpose coatings... view more

Modified cycloaliphatic amine curing agent. Exhibits good gloss, light fastness and resists tendency to blush. Recommended for solventless coatings and gel coats... view more