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Coatings Ingredients
The material selection platform
Coatings Ingredients
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71 products match your search
Product Name
Supplier
Description
DIC Corporation
Alkyl phenol mono glycidyl ether. Acts as a reactive diluent. It is a 100% reactive system. Exhibits super low viscosity and also achieves very low viscosity when mixed with liquid epoxy resins... view more
DIC Corporation
EPICLON® 830 is bisphenol-F type epoxy resin by DIC Corporation. Used in non-solvent-based coatings including shipbuilding, heavy duty (anti-corrosive), floor, and concrete coatings. EPICLON® 830 is... view more
DIC Corporation
EPICLON® B-570-H by DIC Corporation is methyl tetra-hydrophthalic anhydride. Used as a curing agent. Reacts with liquid resins during film forming process to give hard, insoluble films. Exhibits... view more
Applications
DIC Corporation
EPICLON® EXA-4816 by DIC Corporation is an epoxy resin with high purity designed for flooring material coatings. Acts as a fast curing agent. Offers excellent flexible toughness, high strength and... view more
DIC Corporation
EPICLON® EXA-835LV is a highly pure bisphenol-F type epoxy resin by DIC Corporation. Exhibits excellent workability and moldability due to low viscosity. Used in non-solvent-based coatings... view more
DIC Corporation
EPICLON® HP-820 by DIC Corporation is high performance liquid epoxy resin with alkyl phenol. Designed for use in coating applications. Exhibits ductility and flexible toughness. EPICLON® HP-820... view more
Applications
DIC Corporation
EPICLON® N-695 by DIC Corporation is epoxy cresol novolac resin. It is a multi-functional resin produced by reacting phenol with formaldehyde followed by subsequent glycidylation with... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in baking finish, can, powder, floor, shipbuilding... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin diluted in xylene. It is formed by reacting epichlorohydrin with bisphenol A followed by dilution in xylene. Exhibits excellent workability. Available in Asian... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin diluted in xylene. It is formed by reacting epichlorohydrin with bisphenol A followed by dilution in xylene. Exhibits excellent workability. Available in Asian... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in baking finish, can, powder, floor, shipbuilding... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin diluted in xylene. It is formed by reacting epichlorohydrin with bisphenol A followed by dilution in xylene. Exhibits excellent workability. Available in Asian... view more
DIC Corporation
Epoxy resin based on tetra-bromo bisphenol A (BPA). It acts as a fire retardant. This brominated epoxy resin offers excellent fire retardancy. Applications include powder coatings... view more
DIC Corporation
Epoxy resin based on tetra-bromo bisphenol A (BPA). It acts as a fire retardant. This brominated epoxy resin offers excellent fire retardancy. Applications include powder coatings... view more
DIC Corporation
Dimer acid modified epoxy resin (75% solid) in xylene. It is flexible and exhibits excellent thermal shock resistance after curing. Used in heavy duty (anti-corrosive), shipbuilding, and baking... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in baking finish, can, powder, shipbuilding, heavy... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in baking finish, can, powder, shipbuilding, heavy... view more
DIC Corporation
Epoxy resin. It is a non-volatile, polyfunctional resin. Provides rapid cure. Used in powder coatings... view more
DIC Corporation
Epoxy resin. It is a non-volatile, polyfunctional resin. Provides rapid cure. Used in powder coatings... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in baking finish, can, coil, powder, shipbuilding... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin diluted in xylene, n-BuOH (n-butanol) and butyl cellosolve. Exhibits excellent workability. Available in Asian countries. Applications include can, coil... view more
DIC Corporation
Bisphenol F type epoxy resin. It is a liquid resin containing low hydrolyzable chlorine content. Exhibits excellent workability and moldability due to low viscosity. Used in non-solvent based... view more
DIC Corporation
Bisphenol F type epoxy resin. It has low tendency for crystallization. Exhibits excellent workability and moldability due to low viscosity. Used in non-solvent based coatings. Applications include... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a liquid resin of low viscosity. Used in non-solvent based and cationic ED (electro-deposition) coatings. Applications include shipbuilding, heavy duty... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a liquid resin comprising low hydrolyzable chlorine. Used in non-solvent based and cationic ED (electro-deposition) coatings. Applications include... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a liquid resin. Used in non-solvent based and cationic ED (electro-deposition) coatings. Applications include shipbuilding, heavy duty (anti-corrosive)... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a distilled resin of high purity. Used in non-solvent based and cationic ED (electro-deposition) coatings. Applications include shipbuilding, heavy duty... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a liquid resin which exhibits low tendency to crystallize. Available in Asian countries. Used in non-solvent based coatings. Applications include flooring... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a liquid resin comprising low content of hydrolyzable chlorine. Used in non-solvent based and cationic ED (electro-deposition) coatings. Applications... view more
DIC Corporation
Epoxy resin diluted with butyl glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Used in non-solvent based coatings. Applications include... view more
DIC Corporation
Epoxy resin diluted with alkyl phenol mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Used in non-solvent based coatings... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a semi-solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in resist inks, shipbuilding, and heavy duty... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin diluted in xylene. It is formed by reacting epichlorohydrin with bisphenol A followed by dilution in xylene. Exhibits excellent workability. Available in Asian... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A to form diglycidyl ethers of bisphenol A. Available in Asian countries. Used in hybrid... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A to form diglycidyl ethers of bisphenol A. Available in Asian countries. Used in hybrid... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A to form diglycidyl ethers of bisphenol A. Available in Asian countries. Used in hybrid... view more
DIC Corporation
Polyamine (amide amine). Acts as a curing agent. Offers high strength. Suitable for low temperature applications. Applications include non-solvent based, floor, and concrete coatings... view more
DIC Corporation
Epoxy resin diluted with alkyl phenol mono-glycidyl ether and alkyl mono-glycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Used in... view more
DIC Corporation
Epoxy resin diluted with 1, 6-hexanediol diglycidyl ether. It is a reactive prepolymer/ polymer containing epoxide groups. Available in Asian countries. Used in non-solvent based coatings... view more
DIC Corporation
Phenoxy resin. It has high molecular weight and is soluble in cyclohexanone. Applications include baking finish, can, and coil coatings... view more
DIC Corporation
Phenoxy resin. It has high molecular weight. Applications include anti-corrosive, baking finish, can, and coil coatings... view more
DIC Corporation
Polyether ester epoxy resin. It is a polyol resin. Soluble in MIBK (methyl isobutyl ketone) and toluene. Used for heavy-duty (anti-corrosive) and shipbuilding coatings... view more
DIC Corporation
Polyether ester epoxy resin. It is a polyol resin. Soluble in MIBK (methyl isobutyl ketone) and MEK (methyl ethyl ketone). Used for heavy-duty (anti-corrosive) and shipbuilding coatings... view more
DIC Corporation
Bisphenol F type epoxy resin. It is a resin of high purity. Exhibits excellent workability and moldability due to low viscosity. Used in non-solvent based coatings. Applications include... view more
DIC Corporation
Modified phenoxy resin. It has high molecular weight. Soluble in PGM-Ac (propylene glycol mono-methyl ether acetate) and xylene. Applications include baking finish and coil coatings... view more
DIC Corporation
Modified phenoxy resin. It has high molecular weight. Soluble in MEK (methyl ethyl ketone), xylene, toluene and PGM-Ac (propylene glycol mono-methyl ether acetate). Applications include baking... view more
DIC Corporation
Modified phenoxy resin. It has high molecular weight. Soluble in toluene, n-butanol, PGM-Ac (propylene glycol mono-methyl ether acetate) and xylene. Applications include baking finish... view more
DIC Corporation
Modified phenoxy resin. It has high molecular weight. Soluble in toluene, n-butanol, PGM-Ac (propylene glycol mono-methyl ether acetate) and xylene. Applications include baking finish... view more
DIC Corporation
Polyether-ester epoxy resin. It has high molecular weight. Soluble in MIBK (methyl isobutyl ketone), xylene and cyclohexanone. Applications include baking finish, can, and coil coatings... view more
DIC Corporation
Phenoxy resin. It has high molecular weight. Soluble in xylene, n-butanol and cyclohexanone. Applications include baking finish, can, and coil coatings... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in PCM (pre-coated metal), baking finish, can, and... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin diluted in xylene and cyclohexanone. It exhibits excellent workability. Available in Asian countries. Applications include can, coil, pre-coated metal (PCM), and... view more
DIC Corporation
Bisphenol A type (BPA) epoxy resin. It is a solid resin formed by reacting epichlorohydrin with bisphenol A. Available in Asian countries. Used in PCM (pre-coated metal), baking finish, can, and... view more
DIC Corporation
Epoxy cresol novolac resin. It is a multi-functional resin of high purity. Exhibits high heat resistance and excellent moldability. Used in solder resist inks... view more
DIC Corporation
Epoxy cresol novolac resin. It is a multi-functional resin produced by reacting phenol with formaldehyde followed by subsequent glycidylation with epichlorohydrin. Exhibits high heat resistance... view more
DIC Corporation
Epoxy cresol novolac resin. It is a multi-functional resin of high purity. Exhibits high heat resistance and excellent moldability. Used in solder resist inks... view more
DIC Corporation
Epoxy cresol novolac resin. It is a multi-functional resin produced by reacting phenol with formaldehyde followed by subsequent glycidylation with epichlorohydrin. Exhibits high heat resistance... view more
DIC Corporation
Epoxy cresol novolac resin. It is a multi-functional resin of high purity. Produced by reacting phenol with formaldehyde followed by subsequent glycidylation with epichlorohydrin. Exhibits high heat... view more
DIC Corporation
Epoxy cresol novolac resin. It is a multi-functional resin of high purity. Exhibits high heat resistance and excellent moldability. Used in solder resist inks... view more
DIC Corporation
Epoxy cresol novolac resin. It is a multi-functional resin produced by reacting phenol with formaldehyde followed by subsequent glycidylation with epichlorohydrin. Exhibits high heat resistance... view more
DIC Corporation
Epoxy cresol novolac resin. It is a multi-functional resin of high purity. Exhibits high heat resistance and excellent moldability. Used in solder resist inks... view more
DIC Corporation
Epoxy cresol novolac resin. It is a multi-functional resin of high purity. Produced by reacting phenol with formaldehyde followed by subsequent glycidylation with epichlorohydrin. Exhibits high heat... view more
DIC Corporation
Epoxy cresol novolac resin. It is a multi-functional resin produced by reacting phenol with formaldehyde followed by subsequent glycidylation with epichlorohydrin. Exhibits high heat resistance... view more
DIC Corporation
Epoxy cresol novolac resin (80% solid) in MEK (methyl ethyl ketone). It is a multi-functional resin. Exhibits high heat resistance. Used in solder resist inks... view more
DIC Corporation
Epoxy cresol novolac resin. It is a multi-functional resin produced by reacting phenol with formaldehyde followed by subsequent glycidylation with epichlorohydrin. Exhibits high heat resistance... view more
DIC Corporation
Epoxy cresol novolac resin (75% solid) in MEK (methyl ethyl ketone). It is a multi-functional resin. Exhibits high heat resistance. Used in solder resist inks... view more
DIC Corporation
Epoxy cresol novolac resin. It is a multi-functional resin of high purity. Exhibits high heat resistance and excellent moldability. Used in solder resist inks... view more
DIC Corporation
Epoxy cresol novolac resin (75% solid) in MEK (methyl ethyl ketone). It is a multi-functional resin. Exhibits high heat resistance. Used in solder resist inks... view more
DIC Corporation
Epoxy phenol novolac. It is a multi-functional resin produced by reaction of phenol with formaldehyde and subsequent glycidylation with epichlorohydrin. Exhibits high heat resistance. Used in... view more
DIC Corporation
Modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. Used in non-solvent based coatings... view more
DIC Corporation
Modified epoxy resin. It is flexible and exhibits excellent thermal shock resistance after curing. Used in non-solvent based coatings... view more
Gabriel Curing Agents
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