Omicure™

Non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. Offers good oxidation aging and improved high temperature performance. Possesses low toxicity/less irritating and low cure temperature... view more

Omicure™ DDA 10 by Huntsman acts as a curing agent for epoxy resins in powder epoxy coatings. It is a micronized dicyandiamide. It can be catalyzed with other latent accelerators. Omicure™ DDA 10 provides... view more

Unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Primarily designed for use in solvent-based compositions. Compatible with all epoxy resins, including Bisphenol A and F... view more

Omicure™ DDA 5 by Huntsman acts as a curing agent that provides good dispersion, prevents settling and maximizes reactivity. It is an ultra-micronized grade of dicyandiamide. It contains... view more

Semi-Micronized dicyandiamide. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F... view more

Monuron N-(4-Chlorophenyl) - N, N-Dimethyl Urea, an aromatic substituted urea. Shows a long latency in formulated systems containing Dicy and epoxy. Suggested use levels < 5 phr. Used as a latent... view more

Omicure™ U-24M by Huntsman is a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings. It is a Micronized aromatic substituted urea. It can reduce the time and temperature of... view more

Aliphatic Bis Urea, a Micronized cycloaliphatic substituted urea. Reduces time and temperature of curing. Provides long room temperature shelf life to epoxy/dicy formulations. Used as a latent... view more

Phenyl Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Most similar in structure to Monuron and Diuron. Does not contain any chlorine. Used as a latent... view more

Toluene Bis Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Provides great degree of acceleration to epoxy/dicy formulations. Used as a latent... view more

Micronized aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured properties in epoxy/dicy formulations. Used as a... view more

Aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured properties to epoxy/dicy formulations. Used as a latent... view more

Omicure™ U-52M by Huntsman is a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings. It is a micronized aromatic substituted urea. It reduces time and temperature of... view more