Technicure® Nano-Dicy

Technicure® Nano-Dicy is a pulverized grade of dicyandiamide with an average particle size of about 1-2 micron. Acts as a curing agent. Provides excellent adhesion to a variety of substrates and has high glass transition temperature. Technicure® Nano-Dicy contains fumed silica to prevent clumping and improve flow. Due to extremely fine particle size, it reacts more fully allowing a faster cure without sacrificing formulation shelf stability. Technicure® Nano-Dicy can be used with accelerators to lower temperature of initiation. The type and loading level of an accelerator will provide excellent balance of low temperature reactivity and formulation shelf stability. Used in composites such as pre-pregs and powder coatings applications. Recommended use level with epoxy resin (EEW=190) is between 3-8 phr.