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Henkel to Exhibit its Printed Electronic Inks and more at Productronica India 2016

Published on 2016-09-20. Author : SpecialChem

Henkel Adhesive Electronics will showcase printed electronic inks for multiple applications along with brand new, thermally conductive Technomelt material thermal management products and a portfolio of structural adhesives for modern display technologies at Productronica India 2016.

Henkel

Next-Generation Printed Electronic Inks


Henkel’s electrically conductive ink technologies are well-established and the innovation progress continues with its latest advances:
  • Loctite ECI 8000 series positive temperature coefficient (PTC) inks 
  • Loctite ECI 7000 series force sensitive resistor (FSR) inks

The line of PTC inks provides performance benefits for applications where fast and uniform heating is required.

Henkel’s Loctite ECI 8000 PTC Inks

  • Includes a variety of formulations to allow for specific switch off temperatures without the use of electronic control units
  • Allows heating to a specific set point, which is then maintained at a constant level
  • There is no risk of overheating and the materials are exceptionally thin for compatibility with very tight spaces

FSR inks enable varying and controllable ranges of electrical resistance aligned to the required sensitivity level of the application.

Loctite ECI 7000 Series FSR Inks

  • Allows product responses based on changing levels of force, as opposed to simply responding to force in general
  • Different intensities of force alter the material’s conductivity
  • Helps control the device response for applications such as medical diagnostic systems, computer touch pads, and music and entertainment devices, among others

Low Pressure Molding with Thermal Conductivity

Henkel will showcase the company’s latest innovation, Technomelt TC 50. New to the award-winning Technomelt portfolio, this novel material delivers the simple processing and protective properties of all Technomelt hot melt adhesives and adds thermally conductive functional capabilities. With three simple steps – insert Technomelt material, mold and test – a self-enclosed electronics assembly is produced in a low-pressure process, accommodating for delicate circuitry and today’s fine-pitch devices. Technomelt TC 50 provides the added benefit of heat dissipation through the encapsulating layer with thermal conductivity of >0.5 W/m-K, making it an ideal dual-function solution for applications such as LEDs drivers, automotive power systems and micro solar inverters.

Structural Adhesives for Display Technologies

Henkel’s full portfolio of structural and hot melt adhesives for various display and peripheral applications will be featured in Henkel booth #3155 throughout the three-day event. Adhesives for cover glass assembly to eliminate mechanical techniques, as well as formulations to facilitate bezel and battery cover bonding are among the many enabling display technologies from Henkel.

About Henkel

Henkel operates worldwide with brands and technologies in three business units: Laundry & Home Care, Beauty Care and Adhesive Technologies. Henkel employs about 50,000 people and reported sales of 18.1 billion € and adjusted operating profit of 2.9 billion € in fiscal 2015 

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