BYK® -R 607

BYK® -R 607 by BYK is a solution of amine functional oligoamides. Acts as rheology additive for solvent-free and solvent-borne systems in conjunction with hydrophilic fumed silica and clay additives. The additive reinforces the network developed by the thixotrope, ensuring that it does not break down, as it usually would when the amine hardener is added. Enables hydrophilic fumed silica or clay additives to be used alone in 2-component epoxy systems. When using the additive, it is not necessary to use hydrophobic fumed silica in epoxy resin and hydrophilic fumed silica in the curing agent to achieve very high layer thicknesses. The additive is added to the curing agent. The spontaneous increase in viscosity is achieved by the formation of hydrogen bonds between the thixotrope and the additive. BYK® -R 607 is recommended for use in protective-, architectural- and general industrial coatings. Recommended dosage is 20-80% additive based on the percentage of hydrophilic, pyrogenic fumed silica and clay additive in the system.