The Universal Selection Source: Coatings Ingredients

Patent

CONDUCTIVE PASTE, LAMINATED CERAMIC PART, PRINTED WIRING BOARD AND ELECTRONIC DEVICE


Application Date:
May 11, 2017
USPTO Patent:
US 15127406
Abstract:

A conductive paste including (A) a silver powder, (B) a glass frit, (C) an organic binder and (D) a powder containing Cu and at least one metal element selected from the group consisting of V, Cr, Mn, Fe and Co. The...

Inventors:
Yoshiaki YOSHII, Niigata-shi, Niigata (JP)
International Classification:
B23K 35/30 (20170511); B22F 3/10 (20170511); B23K 1/00 (20170511); B23K 35/02 (20170511); B23K 35/36 (20170511); H05K 3/12 (20170511); H05K 1/09 (20170511); H05K 3/34 (20170511); H01B 1/22 (20170511); H05K 1/18 (20170511); C09D 5/24 (20170511); C03C 8/18 (20170511); C03C 8/02 (20170511); C03C 4/14 (20170511); C03C 3/14 (20170511); B22F 1/00 (20170511)

Claims

What is claimed is:

1. A conductive paste which comprises the following components (A) to (D): (A) a silver powder;(B) a glass frit;(C) an organic binder;(D) a powder containing Cu and at least one metal element selected from the group consisting of V, Cr, Mn, Fe and Co.

Description

TECHNICAL FIELD

The present invention relates to, for example, a conductive paste which can be used for formation of an external electrode of a laminated ceramic part or a conductor pattern of a printed wiring board.

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