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Patent

B-STAGE FILM ADHESIVE COMPATIBLE WITH AQUEOUS INK FOR PRINTHEAD STRUCTURES INTERSTITIAL BONDING IN HIGH DENSITY PIEZO PRINTHEADS FABRICATION FOR AQUEOUS INKJET


Application Date:
May 11, 2017
USPTO Patent:
US 15410058
Abstract:

A method for forming an ink jet printhead comprises processing an epoxy adhesive such that negative effects from physical contact with particular inks are reduced or eliminated. Conventional adhesives processed usin...

Inventors:
Yanjia Zuo, Rochester NY (US)
Mandakini Kanungo, Penfield NY (US)
Hong Zhao, Webster NY (US)
Pratima Gattu Naga Rao, Sherwood OR (US)
Mark A. Cellura, Webster NY (US)
Santokh S. Badesha, Pittsford NY (US)
John R. Andrews, Fairport NY (US)
International Classification:
B41J 2/14 (20170511)

Claims

What is claimed is:

1. An ink jet printhead, comprising: a first substrate;a second substrate;an epoxy adhesive interposed between the first substrate and the second substrate that physically connects the first substrate to the second substrate, wherein the epoxy adhesive: comprises a cresol novolac and bisphenol A epoxy resin;has a lap shear strength greater than 200...

Description

PRIORITY

This application is a divisional of application Ser. No. 14/265,119, filed Apr. 29, 2014, now allowed, which was a continuation-in-part of application Ser. No. 13/893,523, filed May 14, 2013, and issued Jun. 9, 2015, as U.S. Pat. No. 9,050,807, the disclosures of which are incorporated herein by reference in their...

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